TITLE

Silicon-based Hermetic Package

PUB. DATE
March 2006
SOURCE
Advanced Packaging;Mar2006, Vol. 15 Issue 3, p39
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article features Hymite A/S's HyCap S QFN/SON hermetic MEMS and IC package which complies with standard QFN/SON packages for high-volume SiP applications. Its silicon encapsulation process allows manufacturers to integrate MEMS with electronic components and passives into one compact package. It allows high hermeticity and vacuum levels, along with electrical connectivity.
ACCESSION #
20228090

 

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