Silicon-based Hermetic Package

March 2006
Advanced Packaging;Mar2006, Vol. 15 Issue 3, p39
Trade Publication
The article features Hymite A/S's HyCap S QFN/SON hermetic MEMS and IC package which complies with standard QFN/SON packages for high-volume SiP applications. Its silicon encapsulation process allows manufacturers to integrate MEMS with electronic components and passives into one compact package. It allows high hermeticity and vacuum levels, along with electrical connectivity.


Related Articles

  • Cutting Edge. Levine, Bernard // Electronic News;1/28/2002, Vol. 48 Issue 5, p8 

    Discusses the opposing market prices and demand of electronic packaging industry in the United States. Decline of the market demand of semiconductor advances; Role of integrated circuits packaging industry on the increase of market demand of electronic packaging; Highlights of the 2002 APEX...

  • CSP Solution.  // Advanced Packaging;Mar2006, Vol. 15 Issue 3, p39 

    The article features Amkor Technology's Flip-Stack CSP which is specifically designed for devices that employ advanced IC fabrication processes. It combines a proprietary flip chip procedure with conventional wire-bond technology to provide a cost-effective, high-performance three-dimensional...

  • Market watch.  // Circuits Assembly;Jul2002, Vol. 13 Issue 7, p18 

    Reports several electronic product enhancement as of July 2002 in the U.S. Market growth for integrated circuit packaging; Development of microelectromechanical systems for optical networking.

  • Trends in Wafer-level Packaging of MEMS. Baert, K.; De Moor, P.; Tilmans, H.; John, J.; Witvrouw, A.; van Hoof, C.; Beyne, E. // Advanced Packaging;Apr2004, Vol. 13 Issue 4, p25 

    Discusses trends in the packaging of microelectromechanical systems (MEMS). Challenge in the development of packaging methods; Goal of integrated circuit packaging; Details on the roadmaps for MEMS wafer processing and packaging.

  • Technologies for Microdevice Packaging. Pelzer, R.; Teomim, D.; Perlberg, G.; Dragoi, V. // Advanced Packaging;Aug2004, Vol. 13 Issue 8, p31 

    Presents packaging requirements for microelectromechanical systems (MEMS) and optical MEMS. Difference between the integrated circuit packaging processes and the MEMS packaging techniques; Technologies used for assembling and interconnecting MEMS devices; Wafer-alignment methods for aligned...

  • To Underfill Or Not To Underfill. Barrett, Kelly // Electronic News;08/21/2000, Vol. 46 Issue 34, p48 

    Focuses on the issue over the application of underfill in integrated circuit packaging. Testing on underfill conducted by the Jet Propulsion Laboratory MicrotypeBGA Consortium; Application of underfill in chip-scale packaging.

  • THE COMMERCIAL MARKET.  // Microwave Journal;Feb2003, Vol. 46 Issue 2, p49 

    Presents updates on the electronic industries commercial market as of February 2003. Performance of microelectromechanical systems in the consumer electronic market; Expected growth of end-user application markets; Increased demand for gallium arsenide-based wireless power integrated circuits

  • Advances in MEMS Packaging. Evans Jr., Daniel D. // Advanced Packaging;Apr2004, Vol. 13 Issue 4, p19 

    Provides understanding of the unique challenges facing microelectromechanical systems (MEMS) engineers compared to traditional integrated circuit packaging. Demand for MEMS component in the market; Annual growth rate of the semiconductor device industry; Application of wafer-to-wafer-level...

  • MEMS Packaging is Still a Challenge. Heeren, Henne van; Salomon, Patrie; Paschalidou, Lia; el-Fatatry, Ayman // Circuits Assembly;Mar2004, Vol. 15 Issue 3, p24 

    This article presents a brief information on different types of electronics packaging. Forecasters and analysts predict the market size for micro-electromechanical systems (MEMS) and microsystems to be $68 billion by the year 2005. The markets for nanotechnology are expected to far exceed...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics