Lead-free Rework: Are You Ready?
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The article discusses head-in-pillow and non-wet open soldering defects in electronic devices. Particular focus is given to the characteristics of each type of soldering defects. How the lack of coalescence between the solder paste deposit and the package solder bump and the lack of wetting to a...
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This article studies tombstoning behavior on a series of lead-free solders and attempts to find a way to control the problem. The move toward lead-free soldering augments the concern about tombstoning, presumably due to the speculated high-surface tension of lead-free solders. Tombstoning has...