TITLE

Lead-free Rework: Are You Ready?

AUTHOR(S)
Peck, Douglas J.
PUB. DATE
February 2006
SOURCE
SMT: Surface Mount Technology;Feb2006, Vol. 20 Issue 2, p48
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article discusses various changes on electronic rework and repair operations in the lead-free transition. New soldering and inspection procedures were required for lead-free solders, component leads, and printed circuit board (PCB) finishes. Higher reflow temperatures as well may cause potential thermal damage for components and PCB. Labeling standards will be important in directing use of rework and repair materials compatible with PCB assembly materials.
ACCESSION #
19791137

 

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