TITLE

RF silicon integration -- back to the future

AUTHOR(S)
Barber, Kevin D.
PUB. DATE
December 2005
SOURCE
Portable Design;Dec2005, Vol. 11 Issue 12, p8
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article presents the author's opinion on RF technology. It is stated by the author that radio frequency (RF) technology has driven significant developments in the manufacturing of mobile hand sets. One of the biggest drivers of RF developments has been the growing demand for extremely feature-rich phones, combined with the migration to advanced communication standards. These trends caused a tiering of handset products to meet the distinct needs of various market segments. Manufacturers have achieved this product tiering by using a combination of system in package (SiP) and system on chip integration paths to achieve the necessary combination of technical capabilities, time-to-market, performance and customization. It is further noted by the author that SiP will continue to be increasingly important, especially in the middle and higher-end product tiers, where design flexibility and cost/performance tradeoffs will continue to favor discrete-component. Sip-based modules have provided critical steppingstones to quad-band and 30 handsets while opening up both space and processing horsepower on the handset platform. SiP also is propelling the industry toward products that move between Wi-Fi and cellular networks.
ACCESSION #
19162864

 

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