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- Telecom, Datacom & Voice ICs. // ECN: Electronic Component News;Nov2002, Vol. 46 Issue 12, p43
Describes various integrated circuits for telecommunications, data communications and voice transmission protocols. Low power media processor from Atsana Semiconductor Corp.; Voice-over-packet silicon PBX from Mindspeed Technologies.
- LED Driver ICs Now Available in Low-Profile Package for Fluorescent Tube Replacements. // Power Electronics Technology Exclusive Insight;2/21/2012, p9
The article cites the availability of Integrations' LinkSwitch-PH LED driver integrated circuits (ICs) in the low-profile eSIP (L package) measuring 2 mm high.
- Silicon Valley direct. Rosen; Frueh, Carol // ECN: Electronic Component News;Dec99, Vol. 43 Issue 12, p51
Features several integrated circuits. Raychem Circuit Protection's RYC8000 family of power distribution switches; Fairchild Semiconductor's 74VCXF162835; FIFO memories.
- No let up in new product introductions. Rosen, Carol // ECN: Electronic Component News;Feb2000, Vol. 44 Issue 2, p31
Introduces innovative integrated circuit (IC) products designed for various data and telecommunication applications requiring ultra high speeds and performance. Includes Vitesse Semiconductor Corp.'s VSC7130 and VSC7132 chips for Fibre Channel and Gigabit Ethernet applications; Condor Inc.'s...
- Integrated circuits. // EDN;01/20/2000, Vol. 45 Issue 2, p133
Features integrated circuit products. Includes Electronic Technology Corp.'s positive voltage regulator; AKM Semiconductor Inc.'s 16-bit stereo codec; Linear Technology Corp.'s hot-swap controller; California Micro Devices' power management devices.
- new products: Integrated Circuits. // EDN;09/14/2000, Vol. 45 Issue 19, p199
Features several integrated circuits. Low-dropout regulator; Latched sink drivers; Three-port Ethernet switch; Gigabit Ethernet controller.
- Find defects in IC packages. Hutter // Test & Measurement World;Sep99, Vol. 19 Issue 11, p21
Focuses on defects in integrated circuit (IC) packages. Functions of the die-attach material used in an IC; Thermal resistance due to delamination; Absorption of internal stresses.
- mu C provides timer function. Smailagich, Tito // EDN Europe;Jan2001, Vol. 46 Issue 1, p56
Presents a design of a microcontroller that provides timer function. Program of desired time interval.
- Muddy Waters in the IA Market. Hesseldahl, Arik // Electronic News;11/13/2000, Vol. 46 Issue 46, p26
Reveals that manufacturers are making chips for information appliances (IA) despite questions on the concept of IA. Examples of IA products; Characteristics of an IA; Factors to be considered by companies developing IA products.