TITLE

Keep cool

AUTHOR(S)
Venables, Mark
PUB. DATE
May 2005
SOURCE
Engineer (00137758);5/3/2005, Vol. 293 Issue 7674, p47
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Reports that makers of enclosures for electronic systems are seeking innovative solutions to keep control of the heat generated as the density of power components increases. Liquid Cooling Package (LCP) from Rittal; Climate-controlled package fitted to the side panel; Key advantages of LCP; Use of heat sinks; Horizontal airflow design by American Power Conversion.
ACCESSION #
17814866

 

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