TITLE

Fabrication and assembly of 3D MEMS devices

AUTHOR(S)
Pascual, Daniel N.
PUB. DATE
July 2005
SOURCE
Solid State Technology;Jul2005, Vol. 48 Issue 7, p38
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article informs that the ability to integrate mechanical elements with supporting electronics on a micro scale has bolstered microelectromechanical systems (MEMS) as an enabling technology, sparking interest in an impressive range of applications. The fabrication of MEMS has certainty benefited from the same equipment and standard processes utilized in the semiconductor industry. A variety of bonding methods exist that can cope with the spectrum of mechanical, electrical, and thermal requirements for MEMS assembly. The majority can be categorized under intermediate-layer bonding due to an additional material used to attach the components being bonded. The most common intermediate materials include metal, glass, and polymers.
ACCESSION #
17563062

 

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