TITLE

UltraCMOS for ultra integration

AUTHOR(S)
Kelly, Dylan; Novak, Rodd
PUB. DATE
June 2005
SOURCE
Portable Design;Jun2005, Vol. 11 Issue 6, p23
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Integration plays a key role in the quest to reduce size, component count, and cost. Semiconductor technologies have been widely accepted as the end-all to integration, and complementary metal oxide semiconductors (CMOS) technologies are leading the charge. The application of this technology reduces the added component count to one and eliminates several low-temperature co-fired ceramic (LTCC) layers by only integrating matching and harmonic filters. Because it is manufactured on a highly insulating substrate, UltraCMOS technology can integrate high-Q passives comparable to those found on LTCC and thin-film silicon devices.
ACCESSION #
17406026

 

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