UltraCMOS for ultra integration

Kelly, Dylan; Novak, Rodd
June 2005
Portable Design;Jun2005, Vol. 11 Issue 6, p23
Integration plays a key role in the quest to reduce size, component count, and cost. Semiconductor technologies have been widely accepted as the end-all to integration, and complementary metal oxide semiconductors (CMOS) technologies are leading the charge. The application of this technology reduces the added component count to one and eliminates several low-temperature co-fired ceramic (LTCC) layers by only integrating matching and harmonic filters. Because it is manufactured on a highly insulating substrate, UltraCMOS technology can integrate high-Q passives comparable to those found on LTCC and thin-film silicon devices.


Related Articles

  • X-Fab Expands Analog Options for 0.6-Micron BiCMOS Process.  // Electronic News;3/24/2003, Vol. 49 Issue 12, pN.PAG 

    Reports on the expansion of the XB05 0.6-micron bipolar complementary metal oxide semiconductor process offerings of X-Fab Group to include One Time Programmable storage functions. Maximum frequency of the XB505 bipolar module; Information on the metal-insulator-metal capacitor available from...

  • CMOS camera detects small AC images awash in DC. Pitter, Mark // Laser Focus World;Jan2005, Vol. 41 Issue 1, p11 

    The article discusses a Complementary metal oxide semiconductors (CMOS) camera. Detecting modulated (AG) optical signals immersed in a steady (DG) background of light is a common challenge for optical systems. In fact, a signal is often modulated expressly to separate it from an unwanted DG...

  • Base cell design spawns advanced arrays. Ajluni, Cheryl // Electronic Design;9/19/94, Vol. 42 Issue 19, p178 

    Describes the basic cell design of the Motorola M5C CMOS arrays. Advantages of the fourth-generation CMOS architecture; Gate-utilization percentage; Implementation of a D-type flip-flop and a two-bit dual-port RAM; Contact information.

  • Is a computer battery failure imminent?  // Supervisory Management;Jan95, Vol. 40 Issue 1, p15 

    Gives advice on computer problems which may be caused by a failing or failed complementary metaloxide semiconductor (CMOS) battery. Symptoms of failure.

  • DESIGN MORE SPEED INTO YOUR PRODUCTS. Kemps, John // Design News;12/7/92, Vol. 48 Issue 23, p67 

    The article features chip technologies offered to engineers from technology industry in the U.S. Many designers prefer Complementary-Metal-Oxide-Semiconductor (CMOS) technology when it comes to speed, low electrical power consumption, dense circuitry and low cost. Systems designer will also move...

  • CMOS imagers fit niche vision needs. Hardin, R. Winn // Vision Systems Design;Aug2004, Vol. 9 Issue 8, p17 

    Discusses the advantages of using complementary-metal-oxide-semiconductor (CMOS) cameras. Use of camera designs containing programmable full descriptors installed in the CMOS sensor; Significance of combining CMOS sensors with gigabytes of local memory for the speed of CMOS sensors; Challenges...

  • POWER SEMICONDUCTORS.  // Electronic Design;1/7/2002, Vol. 50 Issue 1, p98 

    Reports developments related to power semiconductors. Efforts of semiconductor vendors to introduce innovations in passive components; Integration of a complete offline switcher on a single CMOS die through high voltage process modifications; Improvements in lateral-diffused metal oxide...

  • Back-side illumination, wafer-scale optics drive 2x-5x jump in CMOS image sensor performance. Baron, Jerôme // Solid State Technology;Jul2010, Vol. 53 Issue 7, p10 

    The article discusses the performance of complementary metal oxide semiconductors (CMOS) image sensors in the U.S. It mentions that CMOS image sensors drive ultrathin silicon that enables back-side illumination (BSI) and integrated wafer-level optics. It notes that image sensor makers were the...

  • Will Silicon Survive Moore's Law?  // American Ceramic Society Bulletin;Apr2008, Vol. 87 Issue 4, p18 

    The article focuses on the alternative materials that can be used by semiconductor industries to support the advancement in nanotechnology. It states that with the recent developments in nanotechnology, semiconductor manufacturers are considering other materials aside from silicon, such as...

  • Computer hardware: Silicon down to the wire. Macilwain, Colin // Nature;7/7/2005, Vol. 436 Issue 7047, p22 

    Introduces the silicon-based complementary metal-oxide semiconductor (CMOS) technology during the 2005 International Semiconductor Technology Roadmap, a venture involving thousands of semiconductor specialists worldwide. Significance of the roadmap in giving attention to alternatives like the...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics