TITLE

Collapse of stamps for soft lithography due to interfacial adhesion

AUTHOR(S)
Hsia, K. J.; Huang, Y.; Menard, E.; Park, J.-U.; Zhou, W.; Rogers, J.; Fulton, J. M.
PUB. DATE
April 2005
SOURCE
Applied Physics Letters;4/11/2005, Vol. 86 Issue 15, p154106
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modeling. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.
ACCESSION #
17185416

 

Related Articles

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics