TITLE

Packaging important factor in high-power automotive apps

AUTHOR(S)
Craig, Alexander; Martin, Stephen
PUB. DATE
May 2005
SOURCE
Portable Design;May2005, Vol. 11 Issue 5, p12
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article focuses on the importance of proper packaging of smart power devices in the automotive industry to allow integration of the power and control functions. The isolation improves ruggedness and reliability. All semiconductor packaging performs some key functions: Packages connect the signal, power, and ground lines on the board to the die. Heat generated by the silicon is conducted from the silicon to the circuit board or surrounding ambient. The package also provides physical support and a layer of environmental protection, especially critical in the harsh automotive space.
ACCESSION #
17097334

 

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