TITLE

Effects of conductive polyaniline (PANI) preparation and platinum electrodeposition on electroactivity of methanol oxidation

AUTHOR(S)
Zhou, H. H.; Jiao, S. Q.; Chen, J. H.; Wei, W. Z.; Kuang, Y. F.
PUB. DATE
April 2004
SOURCE
Journal of Applied Electrochemistry;Apr2004, Vol. 34 Issue 4, p455
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
A modified galvanostatic method, termed the �pulse galvanostatic method� (PGM) was used to synthesize nanofibular polyaniline (PANI). In contrast to granular PANI prepared by the conventional galvanostatic method (GM), nanofibular PANI has better conductivity and higher specific surface area. The nanofibular PANI electrode modified by Pt microparticles, at the same Pt loading, exhibits a considerably higher electrocatalytic activity on the methanol oxidation than that of the granular PANI electrode modified by Pt microparticles. Furthermore, the PGM method can be used as a good method for Pt microparticle electrodeposition. The composite electrode composed of PANI and Pt microparticles has the best electrocatalytic activity in the experimental range. The effects of Pt loading and methanol concentration, on the electrocatalytic activity for methanol oxidation have also been researched.
ACCESSION #
16781900

 

Related Articles

  • Effect of crown ether on the electrodeposition of a copper-cadmium alloy from aqueous-ethanol perchlorate baths. Kuznetsov, V.; Skibina, L.; Geshels’, S. // Protection of Metals;Jan2006, Vol. 42 Issue 1, p75 

    A correlation between the effect of crown ether on the electrodeposition of a Cu-Cd alloy from perchlorate aqueous-ethanol baths and the liquid phase composition was found. The best inhibition by crown ether was found to occur in a range of the water structure stabilization by ethanol molecules...

  • Co-electrodeposition and Characterization of Cu (In, Ga)Se2 thin films. Xia Donglin; Xu Man; Li Jianzhuang; Zhao Xiujian // Journal of Materials Science;Apr2006, Vol. 41 Issue 7, p1875 

    Cu (In, Ga)Se2(CIGS) thin films were electrodeposited on Mo-coated soda lime glass substrate by the electrodeposition technique. The chemical bath for co-electrodeposition was prepared from copper chloride, indium chloride, gallium chloride and selenous acid. The effect of different chemical...

  • Rinsing effect of alkaline electrolyzed water on nickel surfaces. Takenouchi, Toshikazu; Shin-Ichi Wakabayashi // Journal of Applied Electrochemistry;Oct2006, Vol. 36 Issue 10, p1127 

    The improvement in the surface cleanliness of electroplated nickel by rinsing in alkaline electrolyzed water (AEW) was determined. When the nickel plated sample was rinsed with the AEW, it was found that the amount of residual sulfate ion on the surface of a sample decreased approximately by...

  • High speed platinum deposition from a sulphamate formulation. Pushpavanam, Malathy // Journal of Applied Electrochemistry;Oct2006, Vol. 36 Issue 10, p1069 

    A sulphamate based bath was identified as being suitable for high-speed platinum plating. The bath offers current efficiency approaching 70–80% and the deposits are bright in appearance. SEM examination showed that the grains are fine and XRD analysis indicates their grain size to be at...

  • Electrodeposition and Characterization of Nanocrystalline Ni-Fe Alloys. Abdel-Karim, R.; Reda, Y.; Muhammed, M.; El-Raghy, S.; Shoeib, M.; Ahmed, H. // Journal of Nanomaterials;2011, p1 

    Nanocrystalline Ni-Fe deposits with different composition and grain sizes were fabricated by electrodeposition. Deposits with iron contents in the range from 7 to 31% were obtained by changing the Ni2+/Fe2+ mass ratio in the electrolyte. The deposits were found to be nanocrystalline with average...

  • The Influence of the Temperature of Calcination on the Leaching of Galvanic Sludge. Ozdemir, O. Dere; Piskin, S. // Journal of Solid Waste Technology & Management;Feb2010, Vol. 36 Issue 1, p394 

    Electroplating is most widely used technique for surface finishing of metals, ceramics and plastics, in which heavy metals such as zinc, copper, nickel, chromium and tin are commonly used. This industry generates enormous quantities of waste sludge that is called galvanic sludge. It is very...

  • Planar Technology for NDT-Ge X-Ray Microcalorimeters: Absorber Fabrication. Lo Cicero, U.; Arnone, C.; Barbera, M.; Collura, A.; Lullo, G.; Perinati, E.; Varisco, S. // AIP Conference Proceedings;12/16/2009, Vol. 1185 Issue 1, p112 

    We have investigated the electroplating process to deposit thick uniform films of tin on a Ge wafer coated with Spin-On Glass, in order to fabricate the absorbers for Ge microcalorimeter arrays. Here we discuss some technological details and propose two alternative metal bilayer to be used as...

  • Fine Smoothing of Conductive Substrate for Permalloy Layer Electroplating. BUTTA, M.; JANOSEK, M.; PILARCIKOVA, I.; KRAUS, L. // Acta Physica Polonica, A.;Jun2014, Vol. 125 Issue 6, p150 

    In this paper we study the influence of the roughness of the copper substrate on the magnetic properties of the FeNi film we electroplate onto it. The roughness and the thickness of the copper substrate are reduced by electropolishing in orthophosphoric acid: we show how to select the working...

  • IBM Unveils Next-gen, Lead-free Packaging Technique.  // Advanced Packaging;Nov2004 Supplement, Vol. 13, p24 

    Reveals the lead-free Controlled Collapse Chip Connection New Process (C4NP) which is a breakthrough in wafer solder bump technology, pioneered by IBM Corp.'s researchers and engineers. Capabilities of the C4NP; Application of the pure molten alloy in producing the fine pitch capability of...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics