Investigation of electroless plating of Ni–W–P alloy films

Du, N.; Pritzker, M.
November 2003
Journal of Applied Electrochemistry;Nov2003, Vol. 33 Issue 11, p1001
Academic Journal
The electroless deposition of Ni–W–P alloy coatings onto metal substrates using H2PO2- as reducing agent from solutions containing nickel sulfate, sodium tungstate, sodium citrate, ammonium sulfate and other additives was studied. At most temperatures (60–80 °C) and pHs (7–11) investigated, bright and coherent coatings uniform in appearance were produced. Phosphorous and tungsten contents ranging from 3.5 to 8 wt % and 0.5 to 6 wt %, respectively, were obtained depending upon solution temperature and pH. Trends such as the effects of pH and temperature on average metal deposition rate and the P content in the alloy are similar to that reported previously for the Ni–P system. Correlation of open-circuit potentials with events occurring at the electrode surface in different solutions and polarization curves provide strong evidence that Ni2+ ions participate in W and P deposition, H2 evolution and H2PO2- oxidation and that H2PO2- ions participate in cathodic reduction. This indicates that the partial reactions for the Ni–W–P system do not occur independently of one another.


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