Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride

Varvara, S.; Muresan, L.; Popescu, I.C.; Maurin, G.
August 2003
Journal of Applied Electrochemistry;Aug2003, Vol. 33 Issue 8, p685
Academic Journal
Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes. SEM and X-ray diffraction analysis were used to examine the morphology and the structure of copper deposits. The kinetic parameters (i0, αc, k0), obtained by both Tafel and Koutecky–Levich interpretations lead to the conclusion that TEBA acts as an inhibitor of copper electrodeposition process, as a consequence of its adsorption on the electrode surface. The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.


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