Fabrication of submicron size electrode via nonetching method for metal ion detection

Younghun Kim; Inhee Choi; Sung Koo Kang; Jeongjin Lee; Jongheop Yi
February 2005
Applied Physics Letters;2/14/2005, Vol. 86 Issue 7, p073113
Academic Journal
A metal ion detector with a submicron size electrode was fabricated by atomic force microscopy lithography using a pre-programmed voltage and a nonetching method. The square frame of the mesa pattern was functionalized by (aminopropyl)triethoxysilane for the metal ion detection, and the remaining portion was used as an electrode by the self-assembly of (3-mercaptopropyl)trimethoxysialne for Au metal deposition. In this module, no metal lining or lead line was required, because the conductive tip (mobile electrode) was in direct contact with the gold-deposited mesa portion (fixed electrode). The conductance changed with the quantity of adsorbed copper ions, due to electron tunneling between the mobile and surface electrodes.


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