TITLE

IC/package co-design: integrated methodology for flip-chip

AUTHOR(S)
Rinebold, Kevin
PUB. DATE
March 2005
SOURCE
Portable Design;Mar2005, Vol. 11 Issue 3, p20
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article discusses the changes in the approach to integrated circuit (IC) and package design. Companies are increasingly adopting flip-chip technology as their preferred die-to-package interconnect method. With flip-chip, there are a number of tasks that require multiple design facets to be balanced across both the die and package domains. A key concept to develop the optimal die and package interface is to create a high quality die and package floor plan early in the silicon planning process when the options are greatest to effect change in either domain. Another aspect of the design is the flexibility to drive a design from one domain into the other. The need for close collaboration between IC and package design has always existed but lacked a driver to move it into mainstream practice. Flip-chip is that driver, and it requires an IC and package co-design methodology to realize its full performance potential.
ACCESSION #
16402472

 

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