TITLE

A yen for better chips

AUTHOR(S)
Excell, Jon
PUB. DATE
February 2005
SOURCE
Engineer (00137758);2/25/2005, Vol. 293 Issue 7669, p33
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article reports that a group of British engineers recently returned from Japan armed with knowledge that some claim could reinvigorate Great Britain's semiconductor industry. Japan's high-volume manufacturing plants have to produce millions of chips to justify their �1.5bn construction costs, a situation that is at odds with today's shorter product lifecycles and the requirement to produce lower numbers of higher volume chips for fashion-led products such as mobile phones. Ian Burnett, external affairs director at JEMI, the mission's co-ordinating body, said that these small, agile production units overcome many of the industry's problems and reduce the cost of wafer processing through addressing the depreciation of typical wafer fab facilities as well as cutting the energy costs.
ACCESSION #
16314666

 

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