Packaging Solutions for Portable Systems

January 2005
Portable Design;Jan2005, Vol. 11 Issue 1, p16
The article reports on packaging solutions for portable systems. Many design qualities are required for effective portable devices, and one of the most important is packaging. National's leadership in small form factor packaging covers Die and Wafer Scale packaging to the technologically advanced LLP packaging. National's LLP provides excellent power dissipation in a tiny footprint. Unlike other leaded plastic packages, the LLP has bottom-side pads for PCB mounting. National is a leader in supplying die products. For OEMs with the right manufacturing lines, this packaging format provides the best size, weight and performance.


Related Articles

  • Soft Landing on Horizon? Custer, Walt; Custer-Topai, Jonathan // CircuiTree;Oct2010, Vol. 23 Issue 9, p34 

    The article discusses the outlook for printed circuit board (PCB) fabrication and assembly, passive components, semiconductors and the electronic equipment end markets for 2010-11. It reports on the rate of global manufacturing growth, global semiconductor shipments, and electronic production....

  • Routing DIFFERENTIAL Pairs. Nagle, Dennis // Printed Circuit Design & Manufacture;Aug2003, Vol. 20 Issue 8, p28 

    Presents information on routing differential pairs of printed circuit boards. Benefits of equal and opposite signals sent down tightly coupled traces; Illustration of constraining differential signals; Basic design rules.

  • PCB BOOK-TO-BILL RATIO.  // SMT: Surface Mount Technology;Jul2004, Vol. 18 Issue 7, p22 

    gReports that the IPC IMS/PCB book-to-bill ratio for April 2004 was 1.11, calculated by averaging the index numbers for orders booked over the past three months and dividing it by the average index numbers for sales billed during the same period. Comparison with PCB book-to-bill ratios in March...

  • Routing BGA Fanout Patterns by PCB region. Pfeil, Charles // Printed Circuit Design & Manufacture;Jul2008, Vol. 25 Issue 7, p48 

    The article presents a concept in applying different types of fanout patterns for ball grid array (BGA) by specific printed circuit board (PCB) region. It offers figures showing the overall view of the VGA and the regions. It is noted that the regions are used to get the most effective fanout...

  • Untitled.  // Electronics Weekly;1/27/2010, Issue 2413, p19 

    The article presents information on package-on-package (PoP) technology. The technology stacks semiconductor components on top of each other which reduces circuitry and board space required by up to 43%. The technology is a boon as smaller and more functional handheld devices in applications...

  • PC-BOARD DESIGN. Maliniak, David // Electronic Design;1/13/2005, Vol. 53 Issue 1, p1 

    This article presents information related to frequently asked questions on PC-board design published in the January 2005 issue of "Electronic Design." Responding to a question related to combination of Spice, IBIS, S-parameter, package, and PC-board models experts suggest that with many board...

  • From polymer transistors toward printed electronics. Clemens, W.; Fix, W.; Ficker, J.; Knobloch, A.; Ullmann, A. // Journal of Materials Research;Jul2004, Vol. 19 Issue 7, p1963 

    Printed organic circuits have the potential to revolutionize the spread of electronic applications. This will be enabled by inexpensive and fast fabrication with printing techniques using soluble organic materials. Two main challenges have to be mastered on the way towards printed electronics....

  • Environmental Award: ANGLIA CIRCUITS.  // Electronics Weekly;11/24/2004, Issue 2172, p31 

    This article reports that PCB manufacturer Anglia Circuits introduced an Environmental Management System in 2000 in response to customers increasing interest in environmentally friendly suppliers. The company identified four main areas for improvement which would give it both environmental...

  • MEMS/SMT Hybrid PCBs Take Design/Assembly Detour. Yu, Michael // SMT: Surface Mount Technology;Jul2012, Vol. 27 Issue 7, p50 

    Why place both MEMS and SMT technology on the same subassembly? The answer can be found in the considerable performance gains achieved within an extremely small system. Size, weight, and power (SWaP) consumption most often drive the OEM to use this combination of MEMS and SMT devices on a PCB.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics