TITLE

Solving the wide-interconnect problem for handheld devices

PUB. DATE
January 2005
SOURCE
Portable Design;Jan2005, Vol. 11 Issue 1, p14
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
The article reports on solving the wide-interconnect problem for handheld devices. Interconnecting baseband or applications processors to megapixel cameras with higher-and-higher-resolution color displays is becoming increasingly challenging. The result of these complex interfaces is higher pin counts and larger interconnects, greater power consumption, and increasing EMI problems. While several serial alternatives have been proposed, none has been a comprehensive approach to video transmission in general or an optimal technical solution in particular. Most solutions require two wires per signal, consume more power, and are more difficult to implement in sub-micron CMOS processes. National's proposed MPL open industry standard solves these problems. MPL uses an innovative ultra low-current signaling technology to support a very high-speed serial link. In its basic form, a master-slave configured link supports transfers of I6O Mbps across just two wires, allowing a link to be implemented on a device using only two pins.
ACCESSION #
15777355

 

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