Environmentally friendly natural polyhydroxylic compounds in electroless copper plating baths: application of xylitol,D-mannitol andD-sorbitol as copper(II) ligands

Norkus, E.; Vaškelis, A.; Jačiauskiene, J.; VaičIūniene, J.; Gaidamauskas, E.; Macalady, D. L.
January 2005
Journal of Applied Electrochemistry;Jan2005, Vol. 35 Issue 1, p41
Academic Journal
The possibility of using xylitol,D-mannitol andD-sorbitol as Cu(II) ligands in electroless copper baths was demonstrated. The ligands mentioned showed good chelating properties for Cu(II) ions in alkaline media (pH>11.5), i.e. under conditions of the use of traditional formaldehyde-containing solutions. Electroless copper plating solutions containing the chelators xylitol,D-mannitol andD-sorbitol are stable and, under the optimal conditions selected, copper coatings up to 3µm thick can be obtained in 1 h at ambient temperatures.


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