From RF to baseband: Trends at the GSM radio interface

Levy, Gary
December 2004
Portable Design;Dec2004, Vol. 10 Issue 12, p18
The article focuses on the developments in the GSM radio interface. Radio partitioning within the GSM handset was dictated predominately by RF design constraints and transceiver integration. As phone buyers pressure handset makers to reduce size and cost while increasing features, the boundaries between the antenna-switch module (ASM), surfaceacoustic-wave (SAW) filters, transceiver, power amplifier (PA) and baseband interface the boundaries are getting blurred. That places a premium on pcb space, bill of materials and performance and presents the handset designer with a wide array of choices at the radio interface. Within the radio subsystem, the transmit signal travels from the transceiver to the PA, where it's routed to the antenna by the antenna switch, which selects between the desired outgoing or incoming RF signal. During the receive operation, the switch directs the incoming signal through the appropriate SAW filter to select the proper frequency band. An input match resides between the SAWs and transceiver. In case of the baseband interface current handsets transfer receive demodulated data and transmit modulated in analog in-phase and quadrature-phase format.


Related Articles

  • Silicon Labs Minimizes RF Complexity with GSM/GPRS Transciever.  // ECN: Electronic Component News;Mar2001, Vol. 45 Issue 3, p1 

    Informs on the Aero transceiver chipset from Silicon Laboratories Inc. which provides a complete RF front end for dual and triple band GSM digital cellular handsets. Features of the transceiver.

  • Fake BTS Attacks of GSM System on Software Radio Platform. Yubo Song; Kan Zhou; Xi Chen // Journal of Networks;Feb2012, Vol. 7 Issue 2, p275 

    The 2G GSM communication system only provides one-way authentication mechanism which just authenticate the identities of mobile users. As we know, this is not resistant to fake BTS attack. But for the huge cost for building a fake BTS before, this kind of attack were not really implemented...

  • Transceiver Chip Set Wrings out GSM Phone Costs. Frenzel, Louis E. // Electronic Design;03/05/2001, Vol. 49 Issue 5, p78 

    Reports on Silicon Laboratories' Aero transceiver chip set for GSM cellphones. Provision of a complete two- or three-band GSM transceiver using only a few external components; 100 percent CMOS highly integrated chip set; Replacement of many components; Enabling of designers to focus on baseband...

  • More CMOS leads to higher integration. Novak, Rodd // Portable Design;Dec2004, Vol. 10 Issue 12, p14 

    The article presents information on the integration of the GSM cellular handset. It is the highest-volume-complicated consumer device ever built, with more than one billion units and counting, continues to grow in functionality. The handset's RF front-end traditionally has been an area that CMOS...

  • Virtual RF Design and Testing. Frenzel, Louis E. // Electronic Design;5/11/2006, Vol. 54 Issue 10, following p95 

    The article presents information on several new wireless technologies in demand. All of these wireless technologies can be easily implemented and incorporated into almost any product due to several new wireless standards and low-cost wireless IC transceivers to meet them. Bluetooth is the most...

  • Dual-mode GSM/UMTS radio base station.  // Telecom Asia;Nov2004, Vol. 15 Issue 11, p35 

    The article discusses a dual-mode radio base station, that is, Global System for Mobile Communications (GSM) and Universal Mobile Telecommunications System (UMTS) radio base station. Nortel Networks Corp.'s GSM-UMTS base transceiver station (BTS) provides a common radio platform for GSM and...

  • Dual band frontend modules.  // Portable Design;May2006, Vol. 12 Issue 5, p38 

    The article presents information about Skywork Inc.'s dual band frontend modules. The SKY77517 and SKY77518 are compact, dual-band transmit GSM/GPRS frontend modules for use in low-cost handsets. The SKY77517 and SKY77518 offer's a complete transmit Voice Channel Occupancy-to-antenna and...

  • "RF-SoC": Integration Trends of On-Chip CMOS Power Amplifier: Benefits of External PA versus Integrated PA for Portable Wireless Communications. Lie, D. Y. C. // International Journal of Microwave Science & Technology;2010, Vol. 2010, Special section p1 

    RFIC integration has seen dramatic progress since the early 1990s. For example, Si-based single-chip products for GSM, WLAN, Bluetooth, and DECT applications have become commercially available. However, RF power amplifiers (PAs) and switches tend to remain off-chip in the context of single-chip...

  • A glance inside the handset: keeping it simple. Carson, Phil // RCR Wireless News;11/6/2006, Vol. 25 Issue 45, p15 

    This article discusses the functions of the basic chips, the power amplifier, the radio frequency transceiver, the analog baseband and the digital baseband. As a signal is captured by the antenna, it passes through a transmit/receive switch to the power-amplifier chip. The transceiver chip...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics