TITLE

Linear analysis of electromigration-induced void instability in AI-based interconnects

AUTHOR(S)
Hao, T.-H.; Li, Q.-m.
PUB. DATE
January 1998
SOURCE
Journal of Applied Physics;1/15/1998, Vol. 83 Issue 2, p754
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Provides a linear analysis of electromigration-induced void instability in AI-based interconnects. Results of studies of a rounded void; Example of a theoretical analysis of linear stability.
ACCESSION #
152410

 

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