TITLE

The real path to widespread multi-die package adoption

AUTHOR(S)
Felton, Keith
PUB. DATE
November 2004
SOURCE
Portable Design;Nov2004, Vol. 10 Issue 11, p23
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
This article focuses on the need for multi-component or multi-die packaging, often known as a stacked die packaging, in order to meet consumers' demand that handheld devices offer advanced capabilities. The challenge lies in designing, modeling, and analyzing the stacked-die assembly to ensure that it meets functional, signal performance/integrity, and manufacturing constraints, all in a cost-effective, timely manner. To meet this challenge, designers need an integrated solution that lets them rapidly construct the stacked die, optimized inter-die, and die-to-substrate connectivity for signal performance, substrate routability, and manufacturability.
ACCESSION #
15215393

 

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