TITLE

Portable packaging trends

PUB. DATE
November 2004
SOURCE
Portable Design;Nov2004, Vol. 10 Issue 11, p20
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Portable applications require smaller, thinner, lighter, and cheaper semiconductor devices. This demand creates a tremendous need for innovative and cost-effective semiconductor packaging solutions. And three package families have evolved to keep up with the increasing application miniaturization: chip-scale, wafer-level, and stacked-die packages. In this article, the author discusses the benefits and mechanism of these three packages.
ACCESSION #
15215383

 

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