Make it even smaller with a W-CSP

Toda, Yoshimitsu
November 2004
Portable Design;Nov2004, Vol. 10 Issue 11, p18
With the miniaturization of mobile communications products and other portable devices, design engineers are struggling to find smaller and thinner chips to use in their small-form-factor designs. Moreover, these designers are looking for low-power solutions that will provide increased performance and more capacity at a lower cost but will consume less board space. One solution that meets these requirements is a wafer-level chip-scale package (W-CSP). In this article, the author discusses how W-CSP works in order to increase quality and performance of mobile communications products.


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