TITLE

Make it even smaller with a W-CSP

AUTHOR(S)
Toda, Yoshimitsu
PUB. DATE
November 2004
SOURCE
Portable Design;Nov2004, Vol. 10 Issue 11, p18
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
With the miniaturization of mobile communications products and other portable devices, design engineers are struggling to find smaller and thinner chips to use in their small-form-factor designs. Moreover, these designers are looking for low-power solutions that will provide increased performance and more capacity at a lower cost but will consume less board space. One solution that meets these requirements is a wafer-level chip-scale package (W-CSP). In this article, the author discusses how W-CSP works in order to increase quality and performance of mobile communications products.
ACCESSION #
15215366

 

Related Articles

  • The real path to widespread multi-die package adoption. Felton, Keith // Portable Design;Nov2004, Vol. 10 Issue 11, p23 

    This article focuses on the need for multi-component or multi-die packaging, often known as a stacked die packaging, in order to meet consumers' demand that handheld devices offer advanced capabilities. The challenge lies in designing, modeling, and analyzing the stacked-die assembly to ensure...

  • Designing Modern 3D Packages with Mixed Technology Content. Viklund, Per // Advanced Packaging;Jan/Feb2008, Vol. 17 Issue 1, p36 

    The article discusses the three-dimensional design packaging method with mixed technology content in electronic packaging. It provides descriptions on how the process is being done to produce a design correctly which includes its flowchart illustrating typical design flow for a multiple-die...

  • Package-on-package (PoP) with Through-mold Vias. Packages, Stacked // Advanced Packaging;Jan/Feb2008, Vol. 17 Issue 1, p40 

    The article presents the author's views regarding the structure and process of package-on-package (PoP) with through-mold vias (TMV) method in electronic packaging. The author states that the TMV design allows PoP lands to be moved closer to the edge of a die compared to bare flip chip or...

  • NIST MICROFABRICATES ATOMIC VAPOR CELLS FOR CHIP-SCALE ATOMIC CLOCKS.  // Journal of Research of the National Institute of Standards & Tec;Nov/Dec2003, Vol. 108 Issue 6, p477 

    Reports on the success of a team of researchers from the National Institute of Standards and Technology (NIST) in the U.S. Defense Advanced Research Projects Agency's Chip Scale Atomic Clock program. Way in which the team achieved success; Characteristics of the cells developed by the team;...

  • From the Road. Flower, Gail // Advanced Packaging;Apr2008, Vol. 17 Issue 3, p7 

    The author reflects in the electronic packaging industry. She refers to her visits to various electronic firms and examines their latest technology in electronics such as the test socket market and the redistributed chip package (RCP), wherein they are fabricated in wafer-style panel and could...

  • ChipPac Expects 120% Growth in 2004.  // Electronic News;12/22/2003, Vol. 49 Issue 51, pN.PAG 

    Reports on the business growth expectations of ChipPac Inc. towards its chip scale package volume in 2004. Market share of ChipPac for stacked-die packages; Decision of company officials to expand chip scale package capacity in their Korean facility; Entry of the company in the wireless and...

  • Semiconductor Product of the Year: CSR.  // Electronics Weekly;11/24/2004, Issue 2172, p25 

    This article reports that Chip Scale Packaging's BlueCore4-ROM was designed to follow the company's theme of integration by combining what used to be several separate solutions onto one piece of silicon with the aim of reducing overall silicon area and cost. The Cambridge-based company used Chip...

  • The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact of Reliability of Solder Joints. Weiping Liu; Ning-Cheng Lee // JOM: The Journal of The Minerals, Metals & Materials Society (TM;Jul2007, Vol. 59 Issue 7, p26 

    The impact reliability of solder joints in electronic packages is critical to the lifetime of electronic products, especially those portable devices using area array packages such as ball-grid array (BGA) and chip-scale packages (CSP). Currently, SnAgCu (SAC) solders are most widely used for...

  • A New and "Handy" Radio.  // PS: Preventive Maintenance Monthly;May2004, Issue 618, p43 

    Features the AN/PRC-127EF hand held squad radio. Distinct features of the communication device; Power requirement; Application of the squad radio.

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics