TITLE

Dynamic stress-induced low-temperature ordering of FePt

AUTHOR(S)
Chih-Huang Lai; Cheng-Han Yang; Chiang, C. C.; Balaji, T.; Tseng, T. K.
PUB. DATE
November 2004
SOURCE
Applied Physics Letters;11/8/2004, Vol. 85 Issue 19, p4430
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
The ordering temperature of FePt was significantly reduced to 275°C by introducing a Cu underlayer on the HF-cleaned Si(001) substrate. A coercivity Hc as high as 6200 Oe can be achieved after postannealing at 275°C, and Hc can be further increased to 7000 Oe after 300°C postannealing. During the formation of copper silicide Cu3Si, the expanded volume induces a dynamic in-plane tensile stress on FePt films, which accelerates the formation of the ordered FePt phase at low temperature. Different from the static stress induced by the lattice mismatch between films and underlayers, the dynamic stress is relaxed after the formation of Cu3Si is completed; therefore, the low-temperature ordering of FePt mainly takes place simultaneously with the evolution of dynamic stress during the formation of Cu3Si. The coercivity of FePt depends on the amount of Cu3Si and on the stress developed by Cu3Si.
ACCESSION #
14974958

 

Related Articles

  • Effect of phase transition in shock-recovered silicon. Kishimura, Hiroaki; Matsumoto, Hitoshi // Journal of Applied Physics;Jan2008, Vol. 103 Issue 2, p023505 

    A series of shock-recovery experiments on a single crystal of silicon up to 38 GPa and characterizations of the recovered samples by x-ray diffraction analysis, Raman spectroscopy, and microscopic observations were performed for a better understanding of residual effects after shock loading by...

  • Effect of Mixed-Mode Ratio on Cryogenic Interlaminar Fracture Toughness of Woven Fabric Glass/Epoxy Laminates. Shindo, Y.; Horiguchi, K.; Kumagai, S.; Shinohe, D. // AIP Conference Proceedings;2004, Vol. 711 Issue 1, p224 

    This paper summarizes the results of an experimental and analytical study conducted to investigate the effect of mixed-mode ratio on the cryogenic interlaminar fracture toughness of woven fabric glass/epoxy laminates. Interlaminar fracture tests were performed and a three-dimensional finite...

  • Tensile, Fracture, Fatigue Life, and Fatigue Crack Growth Rate Behavior of Structural Materials for the ITER Magnets: The European Contribution. Nyilas, A.; Nikbin, K.; Portone, A.; Sborchia, C. // AIP Conference Proceedings;2004, Vol. 711 Issue 1, p176 

    Fatigue crack growth rates (FCGR) are determined for R ratios between 0.1 – 0.7 at 7 K for three full-size Mock-up Models of the ITER Toroidal Field coil case produced by modified Type 316LN alloys. A representative forged block of Model 3 is additionally manufactured to determine its...

  • Neutron Diffraction Characterization of Residual Strain in Welded Inconel 718 for NASA Space Shuttle Flow Liners. Rathod, C. R.; Livescu, V.; Clausen, B.; Bourke, M. A. M.; Notardonato, W. U.; Femminineo, M.; Vaidyanathan, R. // AIP Conference Proceedings;2004, Vol. 711 Issue 1, p167 

    This work quantitatively assesses residual strains and stresses associated with the weld repair process used to repair cracks on NASA’s space shuttle flow liners. The coupons used in this investigation were made of the same INCONEL 718 alloy used for the flow liners. They were subjected...

  • Effect of Stress Ratio on High-Cycle Fatigue Properties of Ti-6Al-4V ELI Alloy Forging at Low Temperature. Yoshinori Ono; Tetsumi Yuri; Toshio Ogata; Saburo Matsuoka; Hideo Sunakawa // AIP Conference Proceedings;Jan2014, Vol. 1574, p23 

    The effect of the stress ratio R (the ratio of minimum stress to maximum stress) on the high-cycle fatigue properties of Ti-6Al-4V extra-low interstitial (ELI) alloy forging was investigated at 293 and 77 K. At 293 K, the fatigue strength at 107 cycles exhibited deviations below the modified...

  • Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact. Jifa Mei; Junwan Li; Yushan Ni; Huatao Wang // Nanoscale Research Letters;Apr2010, Vol. 5 Issue 4, p692 

    The process of nanocontact including indentation and retraction between a large Ni tip and a Cu substrate is investigated using quasicontinuum (QC) method. The multiscale model reveals that significant plastic deformation occurs during the process of nanocontact between Ni tip and Cu substrate....

  • Lattice relaxation mechanism of ZnO thin films grown on c-Al2O3 substrates by plasma-assisted molecular-beam epitaxy. Park, S. H.; Hanada, T.; Oh, D. C.; Minegishi, T.; Goto, H.; Fujimoto, G.; Park, J. S.; Im, I. H.; Chang, J. H.; Cho, M. W.; Yao, T.; Inaba, K. // Applied Physics Letters;12/3/2007, Vol. 91 Issue 23, p231904 

    We report on the lattice relaxation mechanism of ZnO films grown on c-Al2O3 substrates by plasma-assisted molecular-beam epitaxy. The lattice relaxation of ZnO films with various thicknesses up to 2000 nm is investigated by using both in situ time-resolved reflection high energy electron...

  • Misfit strain relaxation by dislocations in SrRuO3/SrTiO3 (001) heteroepitaxy. Sang Ho Oha, J.; Chan Gyung Park // Journal of Applied Physics;5/1/2004, Vol. 95 Issue 9, p4691 

    Misfit relaxation by dislocations in perovskite SrRuO3/SrTiO3 (001) heterostructure with low lattice mismatch (f=0.64%) was studied. Pure edge misfit dislocations (MDs) with a Burgers vector of the a<011> type were found to be the major interfacial defects responsible for the misfit relief. They...

  • Electrical and lattice vibrational behaviors of graphene devices on flexible substrate under small mechanical strain. Lee, Yun-Hi; Kim, Yoon-Joong // Applied Physics Letters;8/20/2012, Vol. 101 Issue 8, p083102 

    We present systematic experimental study on the electrical response and two-phonon Raman scattering mode of graphene under small uniaxial strain. The graphene, which was initially grown by chemical vapor deposition, was transferred to a transparent-flexible-polyethylene-terephthalate substrate....

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics