Multilayer three-dimensional photolithography with traditional planar method

Yao, Peng; Schneider, Garrett J.; Miao, Binglin; Murakowski, Janusz; Prather, Dennis W.; Wetzel, Eric D.; O'Brien, Daniel J.
October 2004
Applied Physics Letters;10/25/2004, Vol. 85 Issue 17, p3920
Academic Journal
We describe and demonstrate a method for the realization of three-dimensional lithography through the use of repeated planar photolithography processes. This process is based on the use of a commercially available resist system and consists of tailoring the resist response by controlling the exposure, development, and baking aspects of the process. In particular, postexposure bake is studied in detail as a primary working mechanism which, when combined with a small UV exposure and strong absorption, vertically confined photoacid is produced. As a result, the possibility of re-exposure in lower layers during top layer exposure is eliminated. In the course of this letter, we discuss issues related to this process and how they were overcome. Last, as a demonstration of the proposed method, we present three- and four-layer, three-dimensional “woodpile” photonic crystal structures.


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