Electrochemical Surface Modification of Aluminium Sheets for Application to Nano-electronic Devices: Anodization Aluminium and Electrodeposition of Cobalt-Copper

Ohgai, T.; Hoffer, X.; Gravier, L.; Ansermet, J.-Ph.
October 2004
Journal of Applied Electrochemistry;Oct2004, Vol. 34 Issue 10, p1007
Academic Journal
A nano-porous anodized aluminium oxide layer was synthesized on the surface of bulk aluminium at a wide range of anodization voltages. The barrier layer at the pore bottom of anodized aluminium oxide layer was chemically etched to make good electrical contact for nanowires electrodeposited in the pores thus formed on metallic aluminium substrates. Cathodic polarization was examined at a wide range of cathode potentials to investigate the electrodeposition behaviour of Cu and Co into the pores. Co81Cu19/Cu multilayered nanowires were fabricated using a pulse-plating technique into the templates. Co-alloy layer and Cu layer thicknesses were adjusted to 10 nm, by controlling the deposition times. The temperature dependence of the resistance of Co81Cu19/Cu multilayered nanowires grown on the template presented clean metallic characteristics and a giant magnetoresistance (GMR) of 23% was reached at 4 K.


Related Articles

  • Effects of SiC and Al2O3 particles on the electrodeposition of Zn, Co and ZnCo. I. Electrodeposition in the absence of SiC and Al2O3. Tulio, Paulo; Carlos, Ivani // Journal of Applied Electrochemistry;Feb2009, Vol. 39 Issue 2, p283 

    Electrodeposition of Zn, Co and ZnCo from acid sulfate solutions onto steel was investigated in this first part of a study of the effects of SiC or Al2O3 particles on these processes and the formation of ZnCo–SiC and ZnCo–Al2O3 electrocomposites. Zn electrodeposition shows a...

  • Copper electrodeposition localized in picoliter droplets using microcantilever arrays. Leïc;hlé, T.; Nicu, L.; Descamps, E.; Corso, B.; Mailley, P.; Livache, T.; Bergaud, C. // Applied Physics Letters;6/19/2006, Vol. 88 Issue 25, p254108 

    A patterning tool that allows electrochemical reactions to take place inside microdroplets is introduced. This tool relies on the use of a microfabricated array of silicon cantilevers that incorporate a channel into which a gold electrode is patterned. The deposition process consists in forming...

  • Electroplating: Panel and Pattern Plating, Part 1. Carano, Michael // Printed Circuit Design & Manufacture;May2008, Vol. 25 Issue 5, p18 

    The article describes the intricacies of electrodeposition technology and its function of building up the thickness of copper in the through holes and on the board surface. The buildup of the conductive layer to a desired thickness is achieved by the electrodeposition of copper, which is in...

  • Codeposition and Microstructure of Nickel–SiC Composite Coating Electrodeposited from Sulphamate Bath. Lin, C. S.; Huang, K. C. // Journal of Applied Electrochemistry;Oct2004, Vol. 34 Issue 10, p1013 

    Ni-SiC composite coatings were electroplated from a nickel sulphamate solution with a SiC suspension, with and without the addition of monovalent thallium ions. Without thallium ions, the incorporated SiC particles did not modify the columnar grain structure of the nickel matrix. Conversely, the...

  • Underpotential deposition of Tl on Ag in the presence of bromide ions � Estimation of specific capacitance for design of electrochemical supercapacitors. Girija, T.C.; Sangaranarayanan, M.V. // Journal of Applied Electrochemistry;May2006, Vol. 36 Issue 5, p531 

    The analysis of underpotential deposition (UPD)-based systems for the development of electrochemical supercapacitors is investigated employing the UPD of Tl on Ag in the presence of bromide ions, as an illustrative example. The specific capacitance is estimated with the help of multi-cycle...

  • An improved electroforming process for Ni?Co?Mn deposition using synchronized electric and magnetic impulse. T.-Y. Chen; D.-C. Wang // European Physical Journal - Applied Physics;Nov2008, Vol. 44 Issue 2, p143 

    The use of additives which raises the density of metal-ion in electroforming solution and the application of impulse current are the common methods to improve the deposition rate of electroforming and to ameliorate the mechanical characteristics of electroforming layer. However, our study...

  • Electrocatalytic Reduction of Nitrate on Activated Rhodium Electrode Surfaces. Tucker, Philip M.; Waite, Michael J.; Hayden, Brian E. // Journal of Applied Electrochemistry;Aug2004, Vol. 34 Issue 8, p781 

    Electrodeposited rhodium films on titanium substrates have been electrochemically activated to produce a high area surface with a specific activity for nitrate electroreduction directly to N2. The activation process involves oxidation/ reduction cycles in an alkaline, KCI electrolyte containing...

  • Measurement of Polarization Parameters Impacting on Electrodeposit Morphology. II: Conventional Zinc Electrowinning Solutions. Adcock, P.A.; Quillinan, A.; Clark, B.; Newman, O.M.G.; Adeloju, S.B. // Journal of Applied Electrochemistry;Aug2004, Vol. 34 Issue 8, p771 

    A new technique for measuring effects of polarization modifiers on nucleation potential and plating potential in polycrystalline electrodeposition was presented in Part I of this series (J. Appl. Electrochem. 32 (2002) 1101-1107). This paper presents the results of application of the proposed...

  • Crack-free, thick rhodium deposition on copper substrate using Rhodex solution. Sadeghi, M.; Afarideh, H.; Aardaneh, K.; Kiyomarsi, M.; Mirzaii, M. // Journal of Radioanalytical & Nuclear Chemistry;Sep2005, Vol. 265 Issue 3, p455 

    Rhodium electrodeposition on a copper substrate was investigated for 103Pd production. The electrodeposition was carried out by the commercially available Rhodex plating baths. The optimum conditions of the electrodeposition for complete depletion of Rh were: 6.2 g/l rhodium, DC current density...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics