TITLE

Reduction Characteristics of Iodate Ion on Copper: Application to Copper Chemical Mechanical Polishing

AUTHOR(S)
Anik, M.
PUB. DATE
September 2004
SOURCE
Journal of Applied Electrochemistry;Sep2004, Vol. 34 Issue 9, p963
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Potentiodynamic and potentiostatic polarization, and the rotating disk electrode technique were used to study the reduction characteristics of iodate (IO3-) ion on copper (Cu). Depending on the relative concentrations of IO3- and H+ two pH regimes were observed. The cathodic current in the first regime (pH > ,3) was controlled by H+ diffusion from the solution to the metal surface. In the second regime (pH > 3 and up to 10-2 m IO3- concentration) the cathodic current was found to be under mixed control, involving reaction control via the electrochemical reduction of IO3- and transport control via the diffusion of I2 (aq). It was concluded that IO3- was an effective oxidant for Cu chemical mechanical polishing (CMP) with strongly acidic (pH < 3) slurries but it was not convenient reagent as an oxidant for Cu CMP with weakly acidic (pH > 3) slurries.
ACCESSION #
14360888

 

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