TITLE

Ultratough nanocrystalline copper with a narrow grain size distribution

AUTHOR(S)
Youssef, Khaled M.; Scattergood, Ronald O.; Murty, K. Linga; Kock, Carl C.
PUB. DATE
August 2004
SOURCE
Applied Physics Letters;8/9/2004, Vol. 85 Issue 6, p929
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We report a unique way of using mechanical milling/in situ consolidation at both liquid-nitrogen and room temperature to produce artifact-free nanocrystalline Cu (23 nm) with a narrow grain size distribution. This nanocrystalline Cu exhibits an extraordinarily high yield strength (770 MPa), as predicted from a Hall–Petch extrapolation, along with good ductility (comparable with ∼30% uniform tensile elongation). Possible factors leading to this excellent optimization of strength and ductility are discussed.
ACCESSION #
14019790

 

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