Simplified nonplanar wafer bonding for heterogeneous device integration

Geske, Jon; Bowers, John E.; Riley, Anton
July 2004
Applied Physics Letters;7/12/2004, Vol. 85 Issue 2, p170
Academic Journal
We demonstrate a simplified nonplanar wafer bonding technique for heterogeneous device integration. The improved technique can be used to laterally integrate dissimilar semiconductor device structures on a lattice-mismatched substrate. Using the technique, two different InP-based vertical-cavity surface-emitting laser active regions have been integrated onto GaAs without compromising the quality of the photoluminescence. Experimental and numerical simulation results are presented.


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