Drastic enhancement of nanoelectromechanical-system fabrication yield using electron-beam deposition

Koenig, Daniel R.; Scheible, Dominik V.; Blick, Robert H.
July 2004
Applied Physics Letters;7/5/2004, Vol. 85 Issue 1, p157
Academic Journal
The most common fabrication processes of nanoelectromechanical structures usually start with a silicon-on-insulator chip and incorporate several lithography and etch steps. The wet etch step, which involves hydrofluoric acid, is generally the most critical of these processing steps. In this letter, we present an enhancement of the wet etch step which relies on electron-beam deposition. The technique of electron-beam deposition utilizes a protective carbon layer which is applied by a scanning electron microscope. It allows us to resolve typical problems associated with the wet etch step and drastically increases the yield.


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