Substrate Engineering Enables Faster Transistors, UMC Says

May 2004
Electronic News;5/24/2004, Vol. 50 Issue 21, pN.PAG
Trade Publication
Reports on the performance increase achieved by the Taiwanese foundry United Microelectronics Corp. for transistors. Percentage of increase in the transistor drive current; Major focus of device development at the company.


Related Articles

  • UMC Moves for 70nm Strained Silicon.  // Electronic News;6/16/2003, Vol. 49 Issue 24, pN.PAG 

    Provides information on strained silicon technology for 70nm transistor unveiled by United Microelectronics Corp. in June 2003. Advantage of the technology; Capabilities.

  • UMC Ends Multi-Unit Structure. Morrison, Gale // Electronic News;06/21/99, Vol. 45 Issue 25, p4 

    Focuses on the move of Taiwan's UMC Group of semiconductor manufacturing entities to end the operation of its joint venture organizations under several names and consolidate operations under single organization. Joint-venture companies which the company have approved the merger into United...

  • UMC to Build 12-inch Fab. Ascierto, Jerry // Electronic News;07/19/99, Vol. 45 Issue 29, p46 

    Reports on the plans of United Microelectronics Corp. to build a wafer fabrication plant in Taiwan. Cost of the investment; Details on the patent infringement suit filed against the company by Oak Technology Inc.

  • Fire destroys equipment at UICC fab in Hsinchu, Taiwan; production held up. P.N.D.; Lunday, Christine // Solid State Technology;Jan98, Vol. 41 Issue 1, p38 

    Reports that a fire destroyed the chipmaking facility of United Microelectronics Corp.'s UICC joint venture in Taiwan. Transfer of production to other sites; Details of the fire; Damages; Remarks from Don Brooks, president of UMC International Operations.

  • UMC Forecasts $32 Billion Foundry Market by 2010. Romanelli, Alex // Electronic News;3/17/2003, Vol. 49 Issue 11, pN.PAG 

    Predicts the growth of the foundry market, according to Peter Chang, vice chairman of United Microelectronics Corp. (UMC). Factors that influence the optimism of the company; Predicted increase in foundry wafer sales; Role of UMC in the 300 millimeter wafer manufacturing.

  • UMC restructures and forms joint ventures. Furst, Al // Solid State Technology;Jan99, Vol. 42 Issue 1, p24 

    Highlights Taiwan-based UMC Group's restructuring plans that includes joint ventures with customers. Company's plan to build a fab in Tainen; Efforts of UMC to achieve greater market share.

  • More fab projects are frozen: Motorola, UMC. McGrath, Dylan; DeTar, Jim // Electronic News;09/21/98, Vol. 44 Issue 2237, p1 

    Reports on Motorola and United Microelectronics Corp.'s (UMC) decision to hold off their fabrication projects due to the downturn of the semiconductor industry in the United States. UMC Group USA president Jim Kupec's opinion on when the expansion plan will be put back on track; Description of...

  • Foundering Foundries? Morrison, Gale; Murphy, Tom // Electronic News;8/19/2002, Vol. 48 Issue 34, p1 

    Presents information on the status of the semiconductor foundry industry in 2002. Decline in yields at Taiwanese foundries; Reaction of Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. to reports of low yields from their fabrication lines; Loss of market share of the...

  • 300mm Still Moving Ahead. Chappell, Jeff // Electronic News;04/23/2001, Vol. 47 Issue 17, p28 

    Focuses on the plans to build 300mm wafers by chipmakers in the United States semiconductor industry. Increase in the percentage of 300mm equipment purchases in early 2001; Details on the 300mm wafer production by Infineon Technologies AG with Motorola Inc.; Information on the 300mm production...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics