Low-cost lithography for 300mm wafer packaging

Hermanowski, James; Cullmann, Elmar
May 2004
Microlithography World;May2004, Vol. 13 Issue 2, p4
Trade Publication
Discusses several lithographic areas for wafer-level packaging (WLP). Types of layers involved in WLP; Reasons for potential overlay inaccuracies for all wafer exposures; Key parameters affecting tool throughput related to exposure strategy.


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