Electric field and temperature-induced removal of moisture in nanoporous organosilicate films

Biswas, N.; Lubguban, J. A.; Gangopadhyay, S.
May 2004
Applied Physics Letters;5/24/2004, Vol. 84 Issue 21, p4254
Academic Journal
The effects of bias-temperature-stress (BTS) or simply temperature-stress (TS) on nanoporous low-k methylsilsesquioxane films are studied. Initially, the as-given and O2 ashed/etched films exhibit physical adsorption of moisture as revealed from the electrical behavior of the samples after 15 days. The temperature stressing at 170 °C volatilized the adsorbed water but is unable to remove chemisorb and hydrophillic Si–OH groups. As a result, the TS films remain susceptible to moisture. BTS at 170 °C also removes adsorbed water. More important, the surfaces under the metal-insulator structure were dehydroxylated by breaking the chemisorb Si–OH group facilitating the formation of siloxane bonds that prevents adsorption of moisture even after 60 days. © 2004 American Institute of Physics.


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