Advances in MEMS Packaging

Evans Jr., Daniel D.
April 2004
Advanced Packaging;Apr2004, Vol. 13 Issue 4, p19
Trade Publication
Provides understanding of the unique challenges facing microelectromechanical systems (MEMS) engineers compared to traditional integrated circuit packaging. Demand for MEMS component in the market; Annual growth rate of the semiconductor device industry; Application of wafer-to-wafer-level bonding to MEMS for lids/caps.


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