TITLE

Advances in MEMS Packaging

AUTHOR(S)
Evans Jr., Daniel D.
PUB. DATE
April 2004
SOURCE
Advanced Packaging;Apr2004, Vol. 13 Issue 4, p19
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Provides understanding of the unique challenges facing microelectromechanical systems (MEMS) engineers compared to traditional integrated circuit packaging. Demand for MEMS component in the market; Annual growth rate of the semiconductor device industry; Application of wafer-to-wafer-level bonding to MEMS for lids/caps.
ACCESSION #
12867203

 

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