TITLE

NEMI's Lead-Free Alloy

AUTHOR(S)
Rae, Alan; Handwerker, Carol
PUB. DATE
April 2004
SOURCE
Circuits Assembly;Apr2004, Vol. 15 Issue 4, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Electronics assembly is moving to lead-free solder worldwide, but concerns still exist about processability, reliability and the choice of available alloys. National Electronics Manufacturing Initiative launched the Lead-Free Assembly Project in 1999 to address the many issues surrounding industry transition to lead-free interconnects and results obtained on processing and reliability of lead-free solder joints are directly applicable today. The NEMI Phase I work was the foundation of the organization's lead-free initiatives.
ACCESSION #
12728546

 

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