Thermal-flow technique for reducing surface roughness and controlling gap size in polymer microring resonators

Chao, Chung-Yen; Guo, L. Jay
April 2004
Applied Physics Letters;4/5/2004, Vol. 84 Issue 14, p2479
Academic Journal
Q factors of microring resonator waveguide devices are primarily limited by the surface-roughness-induced scattering loss. Such surface roughness loss has been observed in waveguides that are fabricated from various types of materials, including semiconductors, dielectrics, and polymers. In this letter, we show that the surface roughness of polymer waveguides can be greatly reduced by a thermal-flow technique, and the effective reduction in waveguide loss was verified experimentally. In addition to smoothing surfaces, this technique can simultaneously shrink the gap distance in the coupling region of polymer microring resonators. This, in turn, provides higher coupling, lessens the difficulty of fabricating submicron gaps, and leads to more compact devices. © 2004 American Institute of Physics.


Related Articles

  • Low-dielectric-constant cross-linking polymers: Film electrets with excellent charge stability. Schwodiauwer, Reinhard; Neugschwandtner, Gerhard S.; Bauer-Gogonea, Simona; Bauer, Siegfried // Applied Physics Letters;12/20/1999, Vol. 75 Issue 25, p3998 

    Details a study on film electrets with excellent charge stability, such as cross-linking low-dielectric-constant polymers benzocyclobutene (BCB) and perfluorocyclobutene (PFCB). Preparation of BCB and PFCB on substrates by spin coating; Onset of molecular motion at the high- and low-temperature...

  • Diffraction on a grating of dielectric cylinders with regular polygonal cross sections on a substrate. Nefedov, I. S.; Solov'ev, A. S. // Optics & Spectroscopy;Mar2008, Vol. 104 Issue 3, p435 

    Diffraction of an electromagnetic wave on a grating consisting of parallel dielectric bars with regular polygonal cross sections placed on a substrate inside a dielectric layer is considered. The problem is solved using the method of integral equations. The logarithmic singularity of the kernel...

  • Magnetic Field Assisted Electrical Discharge Machining of AISI 4140. Walkar, Hemant; Jatti, Vijaykumar S.; Singh, T. P. // Applied Mechanics & Materials;2014, Issue 592-594, p479 

    Electric discharge machining(EDM) is a non-conventional machining process in which material removal take place by a series of electric spark generated between the small gap of both electrode and both immersed in dielectric medium. The gap conditions of EDM significntly affect the stability of...

  • Processing of AlO-SiC-TiC ceramic composite by powder mixed electric discharge grinding. Satyarthi, M.; Pandey, Pulak // Mechanics of Advanced Materials & Modern Processes;11/14/2016, Vol. 2 Issue 1, p1 

    Background: The machining of conductive alumina ceramic was successful by the electric discharge grinding (EDG). Therefore, the aim of the present work is to increase the material removal rate (MRR) during EDG of conductive alumina ceramic by addition of ceramic powder with dielectric. Methods:...

  • Microwave dielectric resonance of a fluoride glass. Taijing, Lu; Dai, Yisheng; Ding, X. Z.; Ong, C. K.; Tan, B. T. G. // Journal of Applied Physics;6/15/1994, Vol. 75 Issue 12, p8219 

    Investigates the dielectric properties of a fluorozirconate glass using a microwave vector network analyzer. Observation of a prominent dielectric resonance; Relation of the dielectric characteristics of materials to physical phenomena; Structural characteristics of the glass.

  • Rotating sample holder for ESR studies of relatively high conductivity, thin samples. Zarifis, V. G. // Review of Scientific Instruments;Dec1987, Vol. 58 Issue 12, p2332 

    We have designed a low-loss dielectric sample holder for positioning very thin, metallic, semiconductor samples in a TE102 cavity for ESR studies at liquid-helium temperatures. The sample holder can be rotated ±15° from the center position, allowing accurate positioning of the...

  • Surface filamentation in semi-insulating silicon. Gradinaru, G.; Sudarshan, T. S. // Journal of Applied Physics;6/1/1996, Vol. 79 Issue 11, p8557 

    Presents information on a study that concluded that the surface flashover process in high-field semiconductor-dielectric systems is an interface process, depending strongly on both the semiconductor and the ambient properties. Experimental procedure; Results and discussion on the study.

  • The race is on: CVD and spin-on vie for the low-k dielectric market. Corbett, Michael A.; Davis, John C. // Solid State Technology;Oct2001, Vol. 44 Issue 10, p40 

    Focuses on the issue of low-k dielectric. Projected sales of low-k precursor chemicals in 2001; Percentage of increase in the sales of low-k precursor chemicals; Applications for low-k precursor chemicals.

  • Self-assembly of single dielectric nanoparticle layers and integration in polymer-based solar cells. Allen, Jonathan E.; Ray, Biswajit; Khan, M. Ryyan; Yager, Kevin G.; Alam, Muhammad A.; Black, Charles T. // Applied Physics Letters;8/6/2012, Vol. 101 Issue 6, p063105 

    A single, self-assembled layer of highly uniform dielectric alumina nanoparticles improves the photovoltaic performance of organic semiconductor bulk heterojunction solar cells. The block copolymer based self-assembly approach is readily amenable to the large areas required for solar cell...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics