TITLE

Via-in-Pad Plated over Design Considerations to Mitigate Solder Separation Failure

AUTHOR(S)
Teng, S. Y.; Peretta, P.; Ton, P.; Kome-ong, V.; Kamanee, W.
PUB. DATE
November 2017
SOURCE
SMT: Surface Mount Technology;Nov2017, Vol. 32 Issue 11, p60
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
No abstract available.
ACCESSION #
126251680

 

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