TITLE

Study of Ti/Au, Ti/Al/Au, and Ti/Al/Ni/Au ohmic contacts to n-GaN

AUTHOR(S)
Qin, Z.X.; Chen, Z.Z.; Tong, Y.Z.; Ding, X.M.; Hu, X.D.; Yu, T.J.; Zhang, G.Y.
PUB. DATE
March 2004
SOURCE
Applied Physics A: Materials Science & Processing;2004, Vol. 78 Issue 5, p729
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
The contacts of Ti/Au, Ti/Al/Au, and Ti/Al/Ni/Au films deposited on n-GaN were studied by current–voltage (I–V) and transmission-line-method measurements. The effect of annealing temperature on specific contact resistivity has been investigated by changing the annealing temperature from 400 to 900 °C. Ti/Al/Au and Ti/Al/Ni/Au films were superior to the bilayer (Ti/Au) in ohmic contact characteristics and thermal stability. The Ti/Al/Ni/Au composite showed the best thermal stability due to the fact that Ni plays a more important role than the alloy of Ti/Al in preventing the interdiffusion of Ti, Al, and Au. The lowest contact resistivity (∼10[sup -7]Ω cm[sup 2]) to n-GaN was obtained for the Ti/Al/Ni/Au sample by short-time/high-temperature annealing. The formation mechanism of ohmic contacts to n-GaN is also discussed.
ACCESSION #
12422192

 

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