TITLE

Solderability in a Lead-Free World

AUTHOR(S)
Hymes, Les
PUB. DATE
February 2004
SOURCE
Circuits Assembly;Feb2004, Vol. 15 Issue 2, p71
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
This article explores the question as whether lead-free solder affect solderability and soldering inspection standards. The author says that solderability verification testing may be carried out at the component supplier's plant, upon receipt into the assembly shop inventory or prior to release for assembly. In wetting balance tests to assess solderability, lead-free alloys exhibit higher surface tension and slower wetting times than lead-bearing alloys, resulting in slower wetting times at given temperatures in the soldering process. The soldering process window encountered with lead-free solder alloys is often narrower than that encountered with leaded solders.
ACCESSION #
12276774

 

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