TITLE

Stacking up card security

AUTHOR(S)
Knight, Helen
PUB. DATE
December 2003
SOURCE
Engineer (00137758);12/5/2003, Vol. 292 Issue 7641, p14
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Looks into the benefits brought about by three-dimensional (3-D) semiconductors developed in Germany for credit and smart cards containing microchips. Usability of smart cards fitted with microchips; Technical problems and errors that can be prevented by 3-D semiconductors; Companies collaborating for a research and development project on this type of device.
ACCESSION #
12110615

 

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