Fujitsu Claims Ultrafine Pitch Bumps, High Precision Flip Chip

December 2003
Electronic News;12/22/2003, Vol. 49 Issue 51, pN.PAG
Trade Publication
Provides information on a packaging technology developed by Fujitsu Ltd. that enables the formation of ultrafine pitch 35-micron solder bumps high-precision flip-chip bonded interconnects. Implication of the technology for connection density; Level of typical solder bumps pitches; Method used in the solder bump technology.


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