TITLE

Put Up or Shut Up on Immersion Tech

AUTHOR(S)
Chappell, Jeff
PUB. DATE
December 2003
SOURCE
Electronic News;12/8/2003, Vol. 49 Issue 49, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the plan of Dutch lithography tool vendor ASML to ship immersion tool to Taiwan Semiconductor Manufacturing Co. (TSMC) by the third quarter of 2004. Significance of the move to ASML; Details of the immersion tool developed by ASML; Challenges faced in the creation of immersion tools; Companies considering to ship immersion technology as of December 8, 2003.
ACCESSION #
11904025

 

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