TITLE

Chips get the bends

AUTHOR(S)
BUSH, STEVE
PUB. DATE
September 2016
SOURCE
Electronics Weekly;9/7/2016, Issue 2678, p12
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article reports on the working of Korea Advanced Institute of Science and Technology (KAIST) with the Korea Institute of Machinery and Materials (KIMM) for the development of flexible silicon ICs and super-flexible oxide transistor backplanes. It mentions the use of flash memory wafers. dies and temporary plastic carrier film for the development of flexible silicon. It also presents the views of Jae-Hyun Kim of KIMM on the same.
ACCESSION #
118039482

 

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