Overall System Packaging

December 2003
Portable Design;Dec2003, Vol. 9 Issue 12, p35
Examines the system packaging of Stockwell Rubber Co., Inc. of Philadelphia, Pennsylvania. Formed thermal packaging; Shielding materials; Adhesives.


Related Articles

  • Stockwell still contributing despite retirement. Dawson, Brad // Rubber & Plastics News;6/17/2002, Vol. 31 Issue 23, p35 

    Focuses on the career of businessman Elbridge F. Stockwell, manager of Stockwell Rubber Co. Inc. in Philadelphia, Pennsylvania. Functions of Stockwell in the company; Educational background; Approaches of Stockwell in management of the company.

  • Change keeps Stockwell fresh. Dawson, Brad // Rubber & Plastics News;3/25/2002, Vol. 31 Issue 17, p1 

    Focuses on the utilization of high-performance silicone and fluorosilicone materials for different applications by Stockwell Rubber Co. Inc. in Philadelphia, Pennsylvania. Expectation of increased annual sales by the company; Reasons of the company in moving into specialized production;...

  • Stockwell changes name to reflect markets it serves. Dawson, Brad // Rubber & Plastics News;10/3/2005, Vol. 35 Issue 5, p4 

    The article reports that Stockwell Rubber Co. Inc. has changed its company name to better reflect the materials and markets it supplies. The Philadelphia-based firm, now known as Stockwell Elastomerics Inc., has a niche in fabricated or molded products made from specialty elastomers as opposed...

  • Right staff, technology important. Dawson, Brad // Rubber & Plastics News;4/4/2005, Vol. 34 Issue 18, p12 

    The article reports that with all the global pressures and the increasing demand from customers, having the right people and parts in place may be more important than ever. T&C Mfg. & Operating Inc. looks for technical personnel with experience and knowledge within the rubber molding industry....

  • LITERATURE.  // Design News;11/9/92, Vol. 48 Issue 21, p72 

    Provides information on product literature available from plastics and composites manufacturers, as of November 9, 1992. Adhesive-backed pads from Stockwell Rubber Co. Inc.; Thermoplastic materials from ARCO Chemical Co.; Thermoplastic and fluoropolymer composites from LNP Engineering Plastics;...

  • Build It and They Will Come. Helmers, Gary // Advanced Packaging;Jul2003, Vol. 12 Issue 7, p21 

    Discusses the lessons learned by the author from watching the film 'Field of Dreams' that is applicable to the electronic packaging industry in the U.S. Need for companies to reinvest in research and development; Importance of maintaining high level of local investments.

  • Approaching packaging as a system. Correira, George // Electronic Design;12/03/96 Supplement, Vol. 44 Issue 25, p65 

    Outlines the steps involved in electronic packaging of a server system. Critical aspects of electronic packaging; Planning the hardware implementation and the integration of the various system elements; Site planning; Application of enclosure technology in modern network environments; Article...

  • Manufacturers of enclosures.  // Electronic Design;12/03/96 Supplement, Vol. 44 Issue 25, p70 

    Provides a list of enclosure or packaging manufacturers for electronic equipment in the United States which was originally published in the June 10, 1996 issue of `Electronic Design.'

  • Close the information gap on IC-package reliability. Ghaffarian, Reza // Electronic Design;08/03/98, Vol. 46 Issue 18, p71 

    Deals with the reliability of electronic packages. Two categories of surface mount package options; Ball-grid arrays; Board-level reliability of chip-scale package assembly; Obstacles to the adoption of the technologies; Primary source of damage in package attachment.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics