TITLE

Ultra-thin die ease thermal management

AUTHOR(S)
Fabel, Michael
PUB. DATE
December 2003
SOURCE
Portable Design;Dec2003, Vol. 9 Issue 12, p18
SOURCE TYPE
Periodical
DOC. TYPE
Article
ABSTRACT
Discusses the use of thin die to ease thermal management in mobile communication systems. Pros and cons of using thin die; Compound semiconductors; Process considerations.
ACCESSION #
11642709

 

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