TITLE

Paste beats solder for conducting heat

PUB. DATE
November 2003
SOURCE
Machine Design;11/20/2003, Vol. 75 Issue 22, p38
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Deals with the development of a carbon-filled organic thermal paste for keeping computers and electronics from overheating, by Deborah Chung, materials engineer at the University of Buffalo. Other uses of the thermal paste.
ACCESSION #
11530944

 

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