TITLE

ChipPac Delivers Six Stacked-Die CSP

PUB. DATE
November 2003
SOURCE
Electronic News;11/17/2003, Vol. 49 Issue 46, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports that ChipPac has delivered the first six stacked-die CSP in a 1.6millimeter profile, as of November 2003. Applications of the chips; Percentage of cell phones in 2004 which will ship with stacked-die packages; Configurable design methodology.
ACCESSION #
11504137

 

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