ChipPac Delivers Six Stacked-Die CSP

November 2003
Electronic News;11/17/2003, Vol. 49 Issue 46, pN.PAG
Trade Publication
Reports that ChipPac has delivered the first six stacked-die CSP in a 1.6millimeter profile, as of November 2003. Applications of the chips; Percentage of cell phones in 2004 which will ship with stacked-die packages; Configurable design methodology.


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