land grid array

December 2015
Computer Desktop Encyclopedia;2015, p1
See LGA.


Related Articles

  • Cinterion Launches LGA Scalable Modules for M2M.  // Remote Site & Equipment Management;Apr/May2009, Vol. 9 Issue 2, p14 

    The article features the land grid array (LGA) modules launched by Cinterion Wireless Modules.

  • MEMS motion sensor: Bosch.  // Control Engineering;Mar2010, Vol. 57 Issue 3, p61 

    The article evaluates the smallest BMA220 g-sensor in land grid array (LGA) housing from Bosch Sensortec.

  • Land-grid Array Capacitor.  // SMT: Surface Mount Technology;Aug2006, Vol. 20 Issue 8, p42 

    The article evaluates the Decoupling Capacitor, a land-grid array in improving system performance manufactured by AVX Corp. in Myrtle Beach, South Carolina.

  • Land-Grid Array Capacitor Series Includes 0805 2-Terminal Case Size.  // Power Electronics Technology;Aug2011, Vol. 37 Issue 8, p46 

    The article offers brief information on the LGC Decoupling Capacitor Series land-grid array (LGA) capacitor from AVX Corp.

  • Decoupling Capacitors Feature Very Low ESL.  // ECN: Electronic Component News;Jul2006, Vol. 50 Issue 8, p14 

    The article evaluates AVX's land-grid array capacitor using a fine copper termination process to deliver advanced decoupling capacitors.

  • LGA/QFN Floating on Reflow. HUNT, CHRIS // Printed Circuit Design & Fab: Circuits Assembly;Sep2012, Vol. 29 Issue 9, p56 

    The article states that good stencil design can help overcome the problem of open solder joints caused by the lifting of a land grid array package during reflow.

  • Array Package Rework--Lead Free Throws a Curve. Rupprecht, Howard // Circuits Assembly;Jul2002, Vol. 13 Issue 7, p30 

    Focuses on the importance of correct reflow profiles and automated equipment to successful reworking array packages for electronics manufacturing in the U.S. Limitation of additional functionality; Significance of cost as the ultimate industry driver; Application of land grid arrays.

  • Inspecting Z-axis interconnects. Million, Bob // Electronic News;01/18/99, Vol. 45 Issue 2253, p40 

    Offers a look at how the electronics industry approaches interconnects within electronics in the United States (US). Advanced packaging market in the US; Impact of packaging technologies used for semiconductors on printed circuit board; Movement towards a ball grid array and land grid array.

  • WHAT'S NEW:.  // Connector Specifier;Jul2003, Vol. 19 Issue 7, p1 

    Introduces two connector and interconnection technology products. PGA connector system from Advanced Interconnections; Land-grid array interposer from Teledyne Interconnect Devices.

  • LGA 1156.  // Computer Desktop Encyclopedia;10/1/2011, p1 

    (Land Grid Array 1156) A motherboard receptacle with 1,156 contacts that is used for Intel Core i5 CPUs. Also called "Socket H." See LGA.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics