TITLE

Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel

AUTHOR(S)
Ke Wu; Naoki Yamazaki; Yutaro Ebina; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka Ojima; Takashi Fujiwara
PUB. DATE
May 2015
SOURCE
Advanced Materials Research;2015, Vol. 806, p311
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Finishing process of sapphire wafer is meeting huge challenge to fulfill the strict requirement of high surface quality in semiconductor industry. Fixed abrasive process, although can guarantee the profile accuracy, leaves damaged layer on the surface or subsurface of sapphire wafer. Chemical mechanical polishing (CMP) is famous for providing great surface roughness, however, sacrifices surface geometrical accuracy. Therefore, a new chromium oxide (Cr2O3) sapphire grinding wheel based on chemical mechanical grinding (CMG) principle has been developed and its performance has also been put into examination. The experiment result has demonstrated that Cr2O3 possesses an outstanding potential in terms of a high material removal rate of sapphire wafer, meanwhile, largely reduces surface roughness from about 150nm to below 10nm in 1 hour. In addition, the design of experiment (DOE) has also been carried out to study the effect of influencing factors towards ultimate surface roughness of sapphire wafer. It reveals that the revolution speed of sapphire wafer bears twice greater influence towards surface roughness than the revolution speed of grinding wheel.
ACCESSION #
110788061

 

Related Articles

  • Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel. Ke Wu; Naoki Yamazaki; Yutaro Ebina; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka Ojima; Takashi Fujiwara // Advanced Materials Research;2016, Vol. 1136, p311 

    Finishing process of sapphire wafer is meeting huge challenge to fulfill the strict requirement of high surface quality in semiconductor industry. Fixed abrasive process, although can guarantee the profile accuracy, leaves damaged layer on the surface or subsurface of sapphire wafer. Chemical...

  • Dressing Characteristics in Nitriding Treated Bearing Steel Under Ceramic Wheel Grinding Conditions. Sung Hoon Oh // International Journal of Control & Automation;Sep2012, Vol. 5 Issue 3, p133 

    In the grinding operation dressing sequence give proper profile and surface dimensions. Dressing eliminates loaded part in the wheel surface and makes wheel edge sharpening. Also specific surface profile in the dressing unit conveys to the material, and this is the main function with the...

  • Internal Grinding Characteristics with Ceramic and CBN in Nitriding Treated Steel. Sung Hoon Oh; Byung-moon So // International Journal of Control & Automation;Sep2012, Vol. 5 Issue 3, p287 

    The internal grinding process has precise and narrow tolerance areas in both its size and form-shaping aspects. In the conventional grinding process, which grinds normal tempered hardened steel, aluminum oxide is predominantly used as a grinding wheel material. This has the advantage of...

  • Fundamental Investigation of Ultrasonic Assisted Surface Grinding of Inconel 718. Sisi Li; Yongbo Wu; Mitsuyoshi Nomura // Advanced Materials Research;2015, Vol. 806, p365 

    Inconel 718 has high yield strength, corrosion resistance, heat resistance and fatigue resistance, and possesses a lower thermal conductivity, leading to high grinding force and heavy wheel damage in grinding of this material. Against these problems, ultrasonic assisted grinding (UAG) can be the...

  • Deep Profiled Slot Grinding on a Nickel-based Alloy with Electroplated CBN Wheels. Zhongde Shi; Elfizy, Amr; Attia, Helmi // Advanced Materials Research;2015, Vol. 806, p3 

    A process for grinding deep profiled slots in a nickel-based alloy with electroplated cubic boron nitride (CBN) wheels and straight oil is presented. These slots were prepared by this process for further grinding with electroplated CBN quills to generate the final fir-tree slots in gas turbine...

  • Grinding Behavior of Yttrium Partially Stabilized Zirconia using Diamond Grinding Wheel. Suya Prem Anand, P.; Arunachalam, N.; Vijayaraghavan, L. // Advanced Materials Research;2015, Vol. 806, p15 

    In recent development of dental restoration, zirconia has been used as a prosthetic material due to their enhanced properties of fracture strength and toughness compared to other ceramic materials. Zirconia based ceramic materials are used in structural application in engineering, such as in the...

  • Development of in-process monitoring system for grinding wheel surface temperature and grinding state. Yoshiya Fukuhara; Shuhei Suzuki; Hiroyuki Sasahara // Advanced Materials Research;2015, Vol. 806, p624 

    Grinding is a machining technology for plane surfaces and cylindrical surfaces in general. In comparison with cutting, higher accuracy can be provided and it is easier to manufacture high-hardness materials using grinding. However, the grinding wheel surface state changes during grinding, and...

  • Grinding Technology of Cylindrical Surface with Protrusion. KATO, Kazuya; MAEDA, Yukio; TANAKA, Hideaki // Advanced Materials Research;2015, Vol. 806, p54 

    Cylindrical parts with a protrusion are expected to be used in the components of consumer electronics and automotive products. The machining efficiency of these parts is very low, making them difficult to be mass-produced. The aim of our present work is to develop a highly accurate and highly...

  • Forces during Grinding Operation and its Relation to the Dressing Cycle. Anand NAMBIAR; Kou MATSUMOTO; Masaru YAMAMOTO; Kazuhito OHASHI; Shinya TSUKAMOTO // Advanced Materials Research;2015, Vol. 806, p78 

    While grinding with CNC cylindrical grinding machines, there are many factors that determine the precision and accuracy of the finished product. These may include dimensional accuracy, surface roughness, circularity (roundness), cylindricity, etc. But all these factors pertain to the work. The...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics