Feinfocus Expands Relationship With the APiA

October 2003
Circuits Assembly;Oct2003, Vol. 14 Issue 10, p8
Trade Publication
Wunstorf, Germany-based Feinfocus has announced the expansion of its membership with the Advanced Packaging & Interconnect Alliance (APiA), an alliance of equipment suppliers and process developers, serves the advanced packaging and interconnect industries. Feinfocus chose to expand this relationship to investigate the importance of X-ray inspection as the semiconductor industry shifts towards wafer-level and system-on-chip packaging. Nanofocus and nanotomography inspection criteria will undoubtedly become more vital as a result of these wafer technology trends and Feinfocus will collaborate with other APiA members on the research of x-ray inspection technology to meet the needs of this evolving marketplace. The company will reinforce the APiA's intent to provide the wafer-level packaging market with a reliable source for their process and production technology needs.


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